Compared Properties of Some Poly(Amide-Imide)s Obtained by Direct Polycondensation

Abstract

Two series of poly(amide-imide)s have been synthesized by direct polycondensation reaction of dicarboxylic acids containing dimethylsilylene or carbonyl group and preformed imides cycles with various aromatic diamines. These polymers show high thermal stability, with initial decomposition temperature being above 300°C and glass transition temperature in the range of 220-270°C. Very thin polymer films deposited by spin-coating technique onto silicon wafers showed a smooth, pinhole-free surface in atomic force microscopy investigations.